Advanced packaging is no longer a quiet back office step for AI accelerators. Trade reporting in early April 2026 frames CoWoS style capacity at TSMC as a binding constraint even while wafer supply grows, with hyperscalers reportedly probing Intel packaging options and OSAT partners taking incremental load. That story now shows up as a measurable inflection in public attention, not only as commentary.
Why consensus still underweights the packaging step
Most earnings models still center wafer starts, DRAM pricing, and accelerator unit demand. Advanced packaging sits lower in the stack, so capac